| Restocking Fee | No |
|---|---|
| All returns accepted | Returns Accepted |
| Item must be returned within | 30 Days |
| Refund will be given as | Money back or replacement (buyer's choice) |
| Return shipping will be paid by | Buyer |
| Type | Thermal Compound |
| Packaging | Syringe |
| Brand | SHIN-ETSU |
| MPN | SHIN-ETSU 7762 |
| Device Type | Thermal Compound |
| Country/Region of Manufacture | Taiwan |
Check the listing for details. High Performance Thermal Grease CPU HeatSink Compound Paste SHIN-ETSU 7762. Condition: New. Listed at 4.99 USD. Customer satisfaction Guarantee! Contact me for any questions. SHIN-ETSU 7762 THERMALGREASE(Syringe 1G) Thermal grease 7762 is a thermal interface material developed by Shi-Etsu Chemical Co., Ltd. To meet the current and future thermal managment requirements of high performance microprocessors. It is used to increase heat sink effectiveness by closing the air gap existing between the top of the processor and the fan heat sink. Air is a thermal insulator with a thermal conductivity of 0.027W/mK. The grease is applied to the raised area on top of the processor after the processor is in the socket. The fan heat sink is centered on the processor top, with the raised areas on the bottom of the heat sink and the processor top aligned. The fan heat sink is firmly pressed to evenly distribute the thermal grease until the metal of the heatsink is felt against the ther metal of the processor top. The excess grease can be removed by wipping with a soft cloth. (Be careful of ESD). Appearance: Gray Viscosity at 25C (pa-s) : 180 Specific gravity at 25 C : 2.55 Volatiel conten after 24hrs. at 150C(%): 2.58 Thermal Conductivity (W/m-C): More than 4.oW/mC (with solvent)/More than 6.0W/mC (without solvent) Handling instruction: 1. Once open the plastic bag, remove the lid, please use it up as soon as possible. 2. Keep away from Children. It is not a toy.