Check the listing for details. Integrated Circuits High Strength Silver Filled Epoxy Adhesive 1 Part AD1, 2.5gm. Condition: New. Listed at 15.99 USD. Technical Product BulletinHeat Dry Electrically Conductive one part silver filled epoxy adhesive 5 gmTHIS PRODUCT DOES NOT CURE/HARDEN UNLESS HIGH HEAT IS APPLIED.We have some different products that do not require heating. GENERAL DESCRIPTION: This epoxy is a single component epoxy, formulated with pure silver power combined wih organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates. It shows slight settling when stored for a long period of time, no caking and willre disperse to a smooth homogeneous state.· This formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.· This compound designed for use in diversified applications as microwave EMI & RFI shielding,in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections, and circuitry. TYPICAL APPLICATIONS:· PC Board repair· Electroplating Base· Electro-forming Base· Printed Circuitry· Tantalum Capacitors· Static Shielding· Electrical Games and toys· Recording Tape· Microwave Applications· Tabulating Cards APPLICATION: This conductive silver coated is formulated for application by brushing, spraying, dipping, banding or stylus. Recommended thinners may be added for individual compositions, to replace solvent losses or to make slight adjustments. Only the recommended thinner should be used. In handling and using organic solvents, the safety precautions recommended by the solvent supplier should be observed SPECIFICATIONS: The specifications of this product meets MIL-C-470689(M1) (1) 12 APRIL 1990 specification for highly conductive, epoxy base silver coating material used for electronic shielding purposes. PRODUCT PROPERTIES:AppearanceSilverCure TypeHeat cureBenefitsHigh strengthPerfect bondEMI & RFI shieldingWave guides Substrates Integrated Circuits Aluminum Copper Magnesium Steel Bronze Nickel Kovar CeramicGlass Phenolic G-10 epoxy glass boards. CatalystAnhydrideHardness, Shore D83UNCURED PROPERTIES:Viscosity @ 25 °C cps6,800Density gm/cc2.35Silver , %70-72Shelf life6 MonthsOperating Temperature-45°C to 170°CPot Life @ 25 °C6 months @ 25°C CURE SCHEDULE:0.7 hours@ 200°C, 392°F1.5 hours@ 180°C, 356°F2.5 hours@ 160°C, 320°F PHYSICAL CHARACTERISTICS:Sheet Resistivity10-12 mΩ/sqBulk Resistivity3x10-5Ω/cmAdhesion Tensile Strength1000 N/cm2 (1500 lb/in2)Lap shear Strength1400 N/cm2 (2000 lb/in2)Thermal Conductivity0.04J/(cm.s. °C):[0.01cal/(cm.s. °C)]Specific heat0.30J/(g. °C) :[0.07 cal/g. °C]Coefficient of Thermal Expansion3x10-5 (m/m)/ °CModulus of elasticity4x1010 Pa (6x105lb/in2)Poisson’s Ratio0.35 GENERAL INFORMATION: For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS). HOW TO USE: 1) Carefully clean and dry all surfaces to be bonded. 2) Apply this product completely mixed adhesive to the prepared surfaces, and gently press these surfaces together. Contact pressure is adequate for strong, reliable bonds; however, maintain contact until adhesive is completely cured. 3) Some separation of components is common during shipping and storage. For this reason, it is recommended that the contents of the shipping container be thoroughly mixed prior to use. 4) Some ingredients in this formulation provided may crystallize when subjected to low temperature storage. A gentle warming cycle of 52°C for 30 minutes prior to mixing components may be necessary. Crystallized epoxy components do not react as well as liquid components and should be re-dissolved prior to use for best results. AVAILABILITY:This epoxy can be supplied in various different packages.***This product will cure only if heat activated**** Check out the two part epoxy listed here: other items! if you cannot use heat to cure the epoxy: RECOMMENDED CURE: Heating to 40-50°C will accelerate the drying Time. Longer cure schedules may be required to optimize properties.Temperature °C(°F)Time (hr)200(392)0.7180(356)1.5160(320)2.5 PRICES: 2.5 gm Syringe ($12.99) + Shipping Fee5 gm Syringe ($20.99) + Shipping Fee10 gm Syringe ($35.99) + Shipping Fee50 gm Jar ($153.99) + Shipping Fee100 gm Jar ($299.99) + Shipping Fee250 gm Jar ($599.99) + Shipping Fee500 gm Jar ($1,099.99) + Shipping Fee * Customs sizes are available upon request Froo www.froo.com | Froo Cross Sell, Free Cross Sell, Cross promote, eBay Marketing, eBay listing Apps, eBay Apps, eBay Application